Exposure method for correcting a focal point, and a method for manufacturing a semiconductor device

ABSTRACT

There is disclosed an exposure method for correcting a focal point, comprising: illuminating a mask, in which a mask-pattern including at least a set of a first mask-pattern and a second mask-pattern mutually different in shape is formed, from a direction in which a point located off an optical axis of an exposure apparatus is a center of illumination, and exposing and projecting an image of said mask-pattern toward an image-receiving element; measuring a mutual relative distance between images of said first and second mask-patterns exposed and projected on said image-receiving element, thereby measuring a focal point of a projecting optical system of said exposure apparatus; and moving said image-receiving element along a direction of said optical axis of said exposure apparatus on a basis of a result of said measurement, and disposing said image-receiving element at an appropriate focal point of said projecting optical system.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of application Ser. No. 10/287,522,filed Nov. 5, 2002 now U.S. Pat. No. 6,967,719, the entire contents ofwhich are incorporated herein by reference.

This application is based upon and claims the benefit of priority fromthe prior Japanese Patent Application No. 2001-341039, filed Nov. 6,2001, the entire contents of which are incorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a method for inspecting a state of anoptical system of an exposure apparatus for use in a semiconductorphoto-lithographic process, an exposure method for correcting a focalpoint, and a method for manufacturing a semiconductor device by using anexposure apparatus.

2. Description of the Related Art

In a general photolithographic process, when forming a fineresist-pattern by using a projection exposure apparatus (stepper),unless a state of an optical system of the exposure apparatus,especially a focal point of the exposure apparatus is set in anappropriate state, it is likely to be out of focus, and it is hard toform a fine pattern as desired. Recently, as the transfer-pattern isbecoming much finer, it is very important to set the precision of thefocal point of the exposure apparatus.

For example, in a semiconductor device of design rule of 0.13 μm, thefocal depth is less than 0.5 μm. In this case, it is preferred to setthe precision of the focal point at higher precision than 1/10 of thefocal depth. Therefore, the focal point must be set at a precision of atleast 0.05 μm. Needless to say, if the setting is high in repeatability,it is meaningless unless the true focal point can be measured precisely.Thus, when manufacturing a semiconductor device of which design rule is0.13 μm, it is important to measure or monitor the focal point of theexposure apparatus at least at a precision of 0.05 μm.

As briefly described above by referring to a specific example, varioustechniques are developed for monitoring accurately the focal point ofthe exposure apparatus, for example, from a transfer-pattern byexposure.

One of such techniques is a monitoring technique by using aphase-shift-pattern. A representative example is disclosed by TimothyBrunner et al. of International Business Machine Corporation (IBM) inpage 541 to 549 of Proc. SPIE vol. 2197 (1994) and in page 236 to 243 ofProc. SPIE vol. 2726 (1996).

This method uses an original plate mask 401 having a sectional structureas shown in FIG. 32. The original plate mask 401 comprises a lightpermeable mask main body 402, and a chromium-made shield 403, and amask-pattern for monitoring (not shown) to be transferred on asemiconductor substrate by exposure is formed on a principal plane ofthe mask main body 402. As its sectional structure is shown in FIG. 32,the mask main body 402 comprises a reference plane 402 a, and a plane402 b shifted in phase by 90 degrees (phase shifter plane), and theshield 403 is disposed in a boundary region of the reference plane 402 aand the phase shifter plane 402 b. A reference-pattern (not shown) isfurther disposed on the reference plane 402 a.

Using the original plate mask 401 thus explained briefly, a mask-patternis exposed on a semiconductor substrate. At this time, if the positionof the semiconductor substrate, that is, the focal point of the exposureapparatus (not shown) is deviated from the best focal point, relativepositions of the mask-pattern (shield) 403 formed in the boundary regionof the reference plane 402 a and the phase shifter plane 402 b and thereference-pattern (not shown) on the reference plane 402 a beingtransferred on the semiconductor substrate are changed. In this case, adeviation amount of the semiconductor substrate from the best focalpoint and a relative position deviation amount are known to have amutually linear relation. This method proposed by Timothy Brunner et al.is intended to monitor accurately the focal point of the exposureapparatus by perceiving the position deviation amount of eachtransfer-pattern by means of, for example, a so-called overlayinspection system, and applying this result in the linear relation.

According to this method, by inspecting plural transfer-patterns exposedby varying the position of the semiconductor substrate, it skips theprocedure of determining the best focal point of the exposure apparatus.That is, the inspection-pattern for measuring the focal point of theexposure apparatus is formed by one exposure, and by measuring thisinspection-pattern, the best focal point of the exposure apparatus canbe determined.

Similar to the monitoring method for Timothy Brunner et al., recently, amonitoring technique of the focal point of the exposure apparatus bymeasuring the position deviation amount of patterns by using the overlayinspection system is disclosed by Shuji Nakao et al. of MitsubishiElectric Corporation in page 733 of Extended Abstracts (The 48th SpringMeeting, 2001); The Japan Society of Applied Physics and RelatedSocieties (March, 2001). In this method, instead of using a special maskhaving the phase shifter 402 b formed therein as in the case above, byusing a general mask having an inspection mask-pattern formed therein byan ordinary light permeable film-pattern of chromium, it is intended tomonitor the focal point of the exposure apparatus.

In this method, when standardized optically by using coherency σ of anilluminating light source of the exposure apparatus, it is characterizedby using an illuminating aperture 501 that can be expressedschematically in the size and shape as shown in FIG. 33. First, theilluminating aperture 501 is disposed at the secondary light source sideof the exposure apparatus so that a center of the illuminating lightsource of the exposure apparatus (not shown) may come to an off-axispoint, substantially located off an optical axis of the exposureapparatus. In such off-axis illuminating condition, a pattern of arelatively large size, for example, 2 μm is exposed. Similarly, apattern of 2 μm is exposed in the illuminating condition in which thecenter of the illuminating light source may substantially come to thecentral position of the optical axis. However, when exposing in thesetwo different illuminating conditions, double exposure is executed sothat each exposed pattern may be a so-calledbox-in-box-inspection-pattern. More specifically, double exposure isexecuted so that the pattern formed in the off-axis illuminatingcondition may come to the inside box, and that the pattern formed in theaxis-center illuminating condition may come to the outside box.

The pattern exposed in the off-axis illuminating condition is deviatedin position while keeping the substantially linear relation depending onthe deviation amount of the focal point, whereas the pattern exposed inthe axis-center illuminating condition is not deviated in position evenif the focal point is changed. In this method, therefore, by measuringthe relative position deviation of an inside pattern and an outsidepattern of the box-in-box-inspection-pattern by a overlay inspectionsystem, it is designed to measure the focal point of the exposureapparatus at the time of exposure.

The reason why this method can be executed is that, when projecting arelatively thick pattern, it is possible to project by the diffractionlight near the principal ray only because the ray for illuminating athick pattern on the mask is hardly diffracted by spreading at a wideangle when passing through the mask. In this method, the pattern formedon the mask may be a pattern made of an ordinary shielding film, and anyspecial phase-shift-pattern is not needed.

In the monitoring method proposed by Timothy Brunner et al., theoriginal plate mask 401 requires a phase shifter 402 b for inducing aphase shift of 90 degrees that is not required usually. As a result, themanufacturing cost of the mask is increased.

In the monitoring method proposed by Shuji Nakao et al. of MitsubishiElectric Corporation, the inspection-pattern (measurement-pattern)cannot be transferred unless double exposures are executed. Therefore,when the focus monitor by this method is applied in the field of massproduction, the time required for exposure increases, and theproductivity is lowered. To measure the focal point at high precision inthis method, it is required to read the position deviation amount of themeasurement-pattern at a precision of several nanometers. Accordingly,at the time of double exposure, the mask and transfer substrate must befixed so as not to be moved between the first exposure and the secondexposure. In such a case of reading at a precision of severalnanometers, in order to assure the precision necessary for measurement,it is required to continue to hold the position of the mask and transfersubstrate at a positional precision of several times higher, that is, 1nm or less. It is, however, very difficult to continue to hold theposition of the mask and transfer substrate (image-receiving element) atsuch precision even by the latest high control technology.

Further, if these problems exist, it is hard to transfer themask-pattern in an appropriate shape, or it is difficult to manufacturefavorable semiconductor devices capable of exhibiting the desiredperformance.

BRIEF SUMMARY OF THE INVENTION

According to an aspect of the invention, there is provided an exposuremethod for correcting a focal point, comprising: illuminating a mask, inwhich a mask-pattern including at least a set of a first mask-patternand a second mask-pattern mutually different in shape is formed, from adirection in which a point located off an optical axis of an exposureapparatus is a center of illumination, and exposing and projecting animage of said mask-pattern toward an image-receiving element; measuringa mutual relative distance between images of said first and secondmask-patterns exposed and projected on said image-receiving element,thereby measuring a focal point of a projecting optical system of saidexposure apparatus; and moving said image-receiving element along adirection of said optical axis of said exposure apparatus on a basis ofa result of said measurement, and disposing said image-receiving elementat an appropriate focal point of said projecting optical system.

According to another aspect of the invention, there is provided a methodfor manufacturing a semiconductor device, comprising: illuminating amask, in which a mask-pattern including at least a set of a firstmask-pattern and a second mask-pattern mutually different in shape isformed, from a direction in which a point located off an optical axis ofan exposure apparatus is a center of illumination, and exposing andprojecting an image of said mask-pattern toward an image-receivingelement; measuring a mutual relative distance between images of saidfirst and second mask-patterns exposed and projected on saidimage-receiving element, thereby inspecting a state of an optical systemof said exposure apparatus; setting said optical system of said exposureapparatus in an appropriate state on a basis of a result of saidmeasurement; disposing a semiconductor substrate having a photosensitivematerial provided thereon on a principal plane at an appropriate focalpoint of a projecting optical system of said exposure apparatus; andforming a resist-pattern by transferring an image of a mask-pattern formanufacturing a semiconductor on said photosensitive material.

According to yet another aspect of the invention, there is provided amethod for manufacturing a semiconductor device, comprising:illuminating a mask, in which a mask-pattern including at least a set ofa first mask-pattern and a second mask-pattern mutually different inshape is formed, from a direction in which a point located off anoptical axis of an exposure apparatus is a center of illumination, andexposing and projecting an image of said mask-pattern toward animage-receiving element; measuring a mutual relative distance betweenimages of said first and second mask-patterns exposed and projected onsaid image-receiving element, thereby measuring a focal point of aprojecting optical system of said exposure apparatus; setting said focalpoint of said projecting optical system in an appropriate state on abasis of a result of said measurement; disposing a semiconductorsubstrate having a photosensitive material provided thereon on aprincipal plane at an appropriate focal point of said projecting opticalsystem; and forming a resist-pattern by transferring an image of amask-pattern for manufacturing a semiconductor on said photosensitivematerial.

According to still another aspect of the invention, there is provided amethod for manufacturing a semiconductor device, comprising:illuminating a mask, in which a mask-pattern including at least a set ofa first mask-pattern and a second mask-pattern mutually different inshape is formed, from a direction in which a point located off anoptical axis of an exposure apparatus is a center of illumination, andexposing and projecting an image of said mask-pattern toward animage-receiving element; measuring a mutual relative distance betweenimages of said first and second mask-patterns exposed and projected onsaid image-receiving element, thereby measuring a focal point of aprojecting optical system of said exposure apparatus; setting said focalpoint of said projecting optical system in an appropriate state on abasis of a result of said measurement, and disposing a semiconductorsubstrate having a photosensitive material provided thereon on aprincipal plane at an appropriate focal point of said projecting opticalsystem; and forming a resist-pattern by transferring an image of amask-pattern for manufacturing a semiconductor on said photosensitivematerial.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

FIG. 1 is a diagram schematically showing a method for inspecting anexposure apparatus according to a first embodiment of the invention.

FIG. 2 is a diagram schematically showing an off-axis amount of anilluminating light according to the first and second embodiments of theinvention.

FIG. 3 is a plan view showing a mask for use in the method forinspecting an exposure apparatus according to the first embodiment.

FIG. 4 is a plan view showing a resist-pattern formed on a substrate byusing the mask in FIG. 3.

FIG. 5 is a diagram showing the relation between a position deviationamount of a thin resist-pattern formed by using the mask in FIG. 3 and adeviation amount from a focal point of the substrate shown by thicknessof each pattern.

FIG. 6 is a diagram showing the relation a position deviation amount ofa thick resist-pattern formed by using the mask in FIG. 3 and thedeviation amount from the focal point of the substrate shown bythickness of each pattern.

FIG. 7 is a diagram schematically showing a state of progress of a rayof exposure light entering toward a relatively thick mask-pattern.

FIG. 8 is a diagram schematically showing a state of progress of a rayof exposure light entering toward a relatively thin mask-pattern.

FIG. 9 is a diagram showing the relation between the relative positiondeviation of two kinds of resist-patterns formed by using the mask inFIG. 3 and the deviation amount from the focal point of the substrateshown by off-axis amount.

FIG. 10 is a plan view showing a modified example of the mask in FIG. 3.

FIG. 11 is a plan view showing a resist-pattern formed on a substrate byusing the mask in FIG. 10.

FIG. 12 is a plan view showing another modified example of the mask inFIG. 3.

FIG. 13 is a plan view showing still another modified example of themask in FIG. 3.

FIG. 14 is a plan view showing a mask for use in a method for inspectingan exposure apparatus according to a second embodiment of the invention.

FIG. 15 is a plan view showing a resist-pattern formed on a substrate byusing the mask in FIG. 14.

FIG. 16 is a diagram schematically showing the relation in a diffractionangle between an illuminating light entering the mask and a diffractionlight generated by the mask-pattern formed on the mask.

FIG. 17 is a diagram showing the relation between a position deviationamount of a resist-pattern by an isolated-line-pattern of the mask inFIG. 14 and the deviation amount from the focal point of the substrateby size of each pattern.

FIG. 18 is a diagram showing the relation between a position deviationamount of a resist-pattern by an L/S-pattern of the mask in FIG. 14 andthe deviation amount from the focal point of the substrate by size ofeach pitch.

FIG. 19 is a diagram showing the relation between the relative positiondeviation amount of each resist-pattern by the L/S-pattern andisolated-line-pattern of the mask in FIG. 14 and the deviation amountfrom the focal point of the substrate.

FIG. 20 is a plan view showing a mask having a mask-pattern formed at apredetermined period.

FIG. 21 is a plan view showing a mask having an opening formedoppositely to mask-patterns at both ends of the mask-pattern in FIG. 20.

FIG. 22 is a plan view showing resist-patterns formed on a substrate byusing the masks in FIG. 20 and FIG. 21.

FIG. 23 is a plan view showing a modified example of the mask in FIG.14.

FIG. 24 is a plan view showing a resist-pattern formed on a substrate byusing the mask in FIG. 23.

FIG. 25 is a diagram showing the relation between the relative positiondeviation of two kinds of resist-patterns by two kinds of L/S-patternsdiffering in pitch and the deviation amount from the focal point of thesubstrate.

FIG. 26 is a plan view showing a modified example of the mask in FIG.14.

FIG. 27 is a plan view showing a resist-pattern formed on a substrate byusing the mask in FIG. 26.

FIG. 28 is a plan view showing another modified example of the mask inFIG. 14.

FIG. 29 is a plan view showing still another modified example of themask in FIG. 14.

FIG. 30 is a diagram schematically showing a method for inspecting anexposure apparatus according to a third embodiment of the invention.

FIG. 31 is a diagram schematically showing a method for inspecting anexposure apparatus according to a fourth embodiment of the invention.

FIG. 32 is a sectional view schematically showing a mask for use in amethod for inspecting an exposure apparatus in a prior art.

FIG. 33 is a plan view schematically showing an 15 illuminating aperturefor use in the method for inspecting an exposure apparatus in the priorart.

DETAILED DESCRIPTION OF THE INVENTION

A method for inspecting an exposure apparatus, an exposure method forcorrecting a focal point, and a method for manufacturing a semiconductordevice according to the invention will be described below, in first tofourth embodiments, while referring to FIG. 1 to FIG. 31.

First Embodiment

Prior to describing a first embodiment, a schematic configuration of ageneral exposure apparatus is explained by referring to FIG. 1. In FIG.1, among various types of exposure apparatus, an exposure apparatus(stepper) 5 of reduction projection type having a so-called telecentricoptical system is illustrated.

The exposure apparatus 5, as shown in FIG. 1, comprises a light source(exposure light source, illuminating light source) 6, an illuminatingoptical system 8, and a projecting optical system 9. The light source 6emits an exposure light 7 including a predetermined wavelength λ. Theilluminating optical system 8 guides the exposure light 7 (illuminatinglight 7 a) emitted from the illuminating light source 6 to a mask(reticle) 1 in which a mask-pattern 4 is formed. The projecting opticalsystem 9 guides an image of the mask-pattern 4 by the exposure light 7(transmitting light 7 b) passing through the mask 1 onto a principalplane 13 a of an image-receiving element 13. Between the illuminatinglight source 6 and the illuminating optical system 8, that is, at thesecondary light source side of the exposure apparatus 5, an illuminatingaperture 12 described later is disposed. This illuminating aperture 12is disposed so that the point substantially located off the optical axis16 of the exposure apparatus 5 may create a state for illuminating themask 1 (mask-pattern 4) from the direction of center of illumination.

In the case of the exposure apparatus 5 having the telecentric opticalsystem, as indicated by single dot chain line in FIG. 1, the opticalaxis 16 of the exposure apparatus 5 is a straight line. Theimage-receiving element 13 is disposed near the focal point (f=0) of theexposure apparatus 5 (projecting optical system 9), that is, near thefocal point of a projection lens 11, with the principal plane 13 a onwhich an image 14 of the mask-pattern 4 is exposed and projected beingat a position facing the projection lens 11. In FIG. 1 and others, forthe ease of understanding of a ray state of the exposure light 7, theray state of the exposure light 7 is expressed optogeometrically andschematically.

The method for inspecting an exposure apparatus of the presentembodiment is described while referring to FIG. 1 to FIG. 13.

First, illumination of the mask 1 by the exposure apparatus 5 isexplained. In the present embodiment, the exposure light 7 (illuminatinglight 7 a) is a KrF excimer laser light of which wavelength λ is 246 nm.A numerical aperture NA_(p) of the projecting optical system 9 of theexposure apparatus 5 is set at 0.68.

The coherency σ of the illuminating optical system 8 is determined inthe following formula (1) assuming a numerical aperture of theilluminating optical system 8 to be NA_(i).σ=NA _(i) /NA _(p)  (1)

In the present embodiment, the illuminating coherency σ of the exposureapparatus 5 can be extended to a maximum of 0.85 σ. In the presentembodiment, the mask-pattern 4 formed in the mask 1 is illuminated froma direction of center of illumination at a point located off a directionalong the optical axis 16 of the exposure apparatus 5. To realize suchillumination (exposure) in a so-called off-axis state, in the presentembodiment, a value of 0.3 σ is used as the value of σ. Whenillumination in this off-axis state is standardized optically, therelation between the location amount (off-axis amount) off the opticalaxis 16 of the illuminating light source 6 and the magnitude of theilluminating light source 6 can be schematically defined as shown inFIG. 2.

To realize illumination in an off-axis state schematically shown in FIG.1 and FIG. 2, in the present embodiment, the illuminating aperture 12 isused. The illuminating aperture 12 is composed of a shield 12 a forshielding the illuminating light 7 a emitted from the illuminating lightsource 6, and a light pass hole 12 b provided to penetrate through theshield 12 a for allowing to pass the illuminating light 7 a emitted fromthe illuminating light source 6. The shield 12 a is formed in a circleof which radius is equivalent to a maximum value of 0.85 σ of theilluminating coherency σ of the exposure apparatus 5 so that themajority of the illuminating light 7 a emitted from the illuminatinglight source 6 may be shielded. The light pass hole 12 b is formed in acircle of which radius is equivalent to 0.3 σ of a substantialilluminating coherency σ of the exposure apparatus 5 in an off-axisstate so that part of the illuminating light 7 a may be allowed to pass.

Further, as shown in FIG. 2, the light pass hole 12 b is disposed at aposition having a center C2 thereof located off a predetermined amountDc from a center C1 of the shield 12 a. The location amount Dc of thelight pass hole 12 b is set larger than the radius of the light passhole 12 b so that the center C1 of the shield 12 a may not be includedin the light pass hole 12 b.

The illuminating aperture 12 thus explained is disposed so that thecenter C1 of the shield 12 a may coincide with the optical axis 16(center of the optical axis 16) of the exposure apparatus 5. As aresult, the exposure light 7 emitted from the illuminating light source6 is shielded in majority by the shield 12 a, and only the exposurelight 7 passing through the light pass hole 12 b becomes an illuminatinglight 7 a, which reaches up to a pupil in an illuminating lens 10 of theilluminating optical system 8. In this case, the illuminating lightsource 6 is set so that its center may be located by the predeterminedamount Dc substantially off the center of the optical axis 16 of theexposure apparatus 5. Accordingly, the mask-pattern 4 formed in the mask1 can be illuminated from a direction of the center of illumination at apoint located off a direction along the optical axis 16 of the exposureapparatus 5. Specifically, as indicated by blank arrow in FIG. 1, aprincipal ray 15 of the exposure light 7 (illuminating light 7 a) can beilluminated from a direction inclined from the optical axis 15 withrespect to the mask-pattern 4. The principal ray 15 illuminated in anoff-axis illuminating state reaches up to the image-receiving element 13as part of the exposure light 7 (projecting light 7 c) substantiallyalong the optical path indicated by blank arrow in FIG. 1.

In the present embodiment, the image-receiving element on which theimage 14 of the mask-pattern 4 is exposed and projected is asemiconductor substrate 13 having a photosensitive material (photoresist) 17 applied on its principal plane (surface) 13 a. Therefore, asthe image of the mask-pattern 4 to be measured, a resist-pattern 14formed by transfer on the photo resist 17 by exposure and projection ismeasured.

The mask 1 used in the present embodiment and the mask-pattern 4 formedon the principal plane of the mask 1 are explained. The mask 1 iscomposed of a mask substrate (mask main body) 2 formed of a lightpermeable material such as glass, and a shield 3 formed of a lightshielding material such as chromium (Cr). The mask-pattern 4 is, asshown in FIG. 3, composed of a set of first mask-pattern 4 a and secondmask-pattern 4 b mutually different in shape. In the present embodiment,the set of first mask-pattern 4 a and second mask-pattern 4 b arecomposed of two parallel lines 4 a, 4 b mutually different in width.

Specifically, the first mask-pattern 4 a is formed as a relatively thinline (band shape) having a specified width W_(T) as shown in FIG. 3. Bycontrast, the second mask-pattern 4 b is formed as a relatively thickline (band shape) having a specified width W_(F) wider than the widthW_(T) of the first mask-pattern 4 a, having the same length as the firstmask-pattern 4 a. The first mask-pattern 4 a and second mask-pattern 4 bare disposed parallel to each other at a specified spacing, across arelative interval (relative distance) D1 _(M) on the mask substrate 2.The length of the relative distance D1 _(M) is predetermined so that atleast the images 14 of the first mask-pattern 4 a and secondmask-pattern 4 b to be exposed and projected on the photo resist 17 maynot overlap with each other. Substantially, the relative distance D1_(M) between the first mask-pattern 4 a and the second mask-pattern 4 bis preferred to be wider than the width W_(F) of the second mask-pattern4 b of relatively thick line. As a result, interference of the images 14of the first and second mask-patterns 4 a, 4 b on the photo resist 17can be ignored.

The mask 1 having such mask-pattern 4 formed therein is illuminated bythe exposure apparatus 5 in an off-axis state as described above, andthe images 14 of the first mask-pattern 4 a and second mask-pattern 4 bare exposed and projected on the photo resist 17. The images 14 of thefirst and second mask-patterns 4 a, 4 b exposed and projected on thephoto resist 17 will be explained below.

As mentioned above, the exposure apparatus 5 is an exposure apparatus ofreduction projection type, and generally the mask-pattern on the maskand an image of a mask-pattern which is actually projected and exposedcannot be directly compared in their size. In the following explanation,therefore, for the ease of comparison of the mask-pattern 4 and theimage 14 of the mask-pattern 4, their dimensions are shown as being set(corrected) to the same multiplying factor (reduction rate).

FIG. 4 shows the resist-pattern 14 formed on the photo resist 17 whenthe mask-pattern 4 is illuminated in an off-axis state setting theoff-axis amount Dc from the optical axis 16 of the illuminating lightsource 6 at 0.3 σ. That is, the diagram shows first resist-pattern 14 aand second resist-pattern 14 b corresponding to the first mask-pattern 4a and second mask-pattern 4 b. Herein, the relative interval (relativedistance) between the first resist-pattern 14 a and the secondresist-pattern 14 b is supposed to be D1 _(W).

At the off-axis amount Dc of the illuminating light source 6 of 0.3 σ,the relation between the position deviation amount d (defocus amount d)from the focal point (f=0) of the projecting optical system 9 (exposureapparatus 5) of the semiconductor substrate 13 (surface of the photoresist 17) and the position deviation amount from the desired projectingposition of the image of a general linear mask-pattern(isolated-line-pattern) to be projected on the surface of the photoresist 17 is shown in FIG. 5 and FIG. 6 as the graph expressed by theline width of the isolated line. In FIG. 5, the width of the isolatedline is 0.2 μm or less, and in FIG. 6, the width of isolated line is0.25 μm or more. As clear from FIG. 5, the image of the mask-patternhaving the width of the isolated line of 0.2 μm or less, the positiondeviation amount is slight regardless of the position deviation amount dfrom the focal point (f=0) of the semiconductor substrate 13, and it iswithin an ignorable measuring error range. For instance, it is about0.02 μm at maximum. By contrast, the image of the mask-pattern havingthe width of the isolated line of 0.25 μm or more, as clear from FIG. 6,the position deviation is about 4 or 5 times as compared with the imageof the mask-pattern having the width of the isolated line of 0.2 μm orless.

The method for inspecting an exposure apparatus of the presentembodiment is characterized by investigating the state of the opticalsystem of the exposure apparatus 5 by making use of the positiondeviation phenomenon depending on the width of the isolated lineexplained above, and the correlative relation with the positiondeviation amount d from the focal point (f=0) of the semiconductorsubstrate 13. In particular, the method for inspecting an exposureapparatus according to the first embodiment is intended to investigatethe focal point (f=0) of the projecting optical system 9 (exposureapparatus 5) by making use of such correlative relation. In the presentembodiment, therefore, the line width W_(T) of the first mask-pattern 4a formed as an isolated line having a relatively thin line width is setat 0.2 μm or less, whereas the line width W_(F) of the secondmask-pattern 4 b formed as an isolated line having a relatively thickline width is set at 0.25 μm or more. The first mask-pattern 4 a andsecond mask-pattern 4 b formed in such dimensions are disposed on themask substrate 2 as shown in FIG. 3 and exposed. More specifically, thewidth W_(T) of the first mask-pattern 4 a is set at 0.15 μm, and thewidth W_(F) of the second mask-pattern 4 b is set at 1.0 μm.

As explained herein, in the case of using a set of mask-patterns 4 a, 4b mutually different in the line width, when the relatively thickmask-pattern, that is, the second mask-pattern 4 b having a line widthof 1.0 μm is illuminated in an off-axis state, a second resist-pattern14 b is formed by the diffraction light 16 near the principal ray 15only, out of the exposure light 7 as shown in FIG. 7. Therefore, whenthe semiconductor substrate (projecting substrate) 13 is disposed at aposition deviated by a specified amount d (defocus point F_(d)) from thefocal point (f=0) of the projecting optical system 9, preferably fromthe best focal point (F_(b)) as indicated by solid line in FIG. 1, theposition at which the second resist-pattern 14 b is formed is alsodeviated depending on the defocus amount d. In the present embodiment,for the simplicity of explanation, the focal point (f=0) of theprojecting optical system 9 and the best focal point F_(b) are theidentical point.

On the other hand, when the relatively thin mask-pattern, that is, thefirst mask-pattern 4 a having a line width of 1.5 μm is illuminated inan off-axis state, as shown in FIG. 8, the diffraction light 16 spreadsaround the principal ray 15. That is, by the exposure light 7(projecting light 7 c) reaching not only to part of the pupil of theprojecting lens 11, but also to the photo resist 17 nearly from itsentire surface, the first resist-pattern 14 a is formed. Therefore, evenif the semiconductor substrate 13 is disposed at the defocus pointF_(d), the position at which the first resist-pattern 14 a is formed ishardly deviated.

Accordingly, by measuring the positions of the second resist-pattern 14b and first resist-pattern 14 a as the images 14 after exposure andprojection respectively of the second mask-pattern 4 b of a relativelythick isolated line and first mask-pattern 4 a of a relatively thinisolated line, the defocus amount d from the best focal point F_(b) ofthe semiconductor substrate 13 can be measured.

Herein, in terms of the wavelength λ of the exposure light 7 and thenumerical aperture NA_(p) of the projecting optical system, theso-called optical standardization amount K is defined in the followingformula (2).K=λ/NAp  (2)

The line widths W_(T), W_(F) of the first and second mask-patterns 4 a,4 b are divided by the standardization quantity K defined in the aboveformula (2), and expressed in standardized values, that is, standardizeddimensions. Therefore, the various setting conditions of the method forinspecting an exposure apparatus of the present embodiment may be easilyapplied (expanded) in an exposure apparatus different in theilluminating wavelength and numerical aperture from the case of thepresent embodiment. Similarly, position deviation amounts of the firstresist-pattern 14 a and second resist-pattern 14 b, or various opticalquantities such as focal point (f=0) of the projecting optical system 9can be also expressed in standardized values by dividing by K. Forexample, a relatively thin isolated line having a line width of 0.2 μmor less may be expressed as a line of standardized dimension of 0.55 orless, or a relatively thick isolated line having a line width of 0.25 μmor more may be expressed as a line of standardized dimension of 0.69 ormore.

FIG. 9 is a graph showing the correlative relation between the defocusamount d from the focal point (f=0) of the projecting optical system 9of the semiconductor substrate 13, and a relative position deviationamount (D1 _(W)−D1 _(M)) of the first resist-pattern 14 a and secondresist-pattern 14 b formed on the photo resist 17, by the extent ofoff-axis amount (off-axis amount) of the illuminating light source 6. Asclear from FIG. 9, when the off-axis amount of the illuminating lightsource 6 is 0.3 σ or more, the correlative relations of the defocusamount d of the semiconductor substrate 13, and the relative positiondeviation amount (D1 _(W)−D1 _(M)) of the first resist-pattern 14 a andsecond resist-pattern 14 b are substantially the same. However, if theoff-axis amount of the illuminating light source 6 is 0.1 σ, the bothcorrelative relations show evidently different behaviors.

It means that the sensitivity for detecting the focal point (f=0) of theprojecting optical system 9 is lowered significantly in a state of theilluminating light source 6 substantially including the optical axis 16even if the center of the illuminating light source 6 is set in anoff-axis state located off the center of the optical axis 16. Therefore,the off-axis amount Dc from the optical axis 16 of the illuminatinglight source 6 in an off-axis state is preferred to be set at a valuelarger than the value of its illumination coherency σ. Morespecifically, in the present embodiment, since the value of theilluminating coherency σ of the illuminating light source 6 in theoff-axis state is set at 0.3 σ, the off-axis amount Dc of theilluminating light source 6 is preferred to be set at a value largerthan 0.3 σ.

In the method for inspecting an exposure apparatus of the presentembodiment, as mentioned above, forming the first resist-pattern 14 aand second resist-pattern 14 b corresponding to the first mask-pattern 4a and second mask-pattern 4 b as mentioned above, their relativedistance D1 _(W) is measured. Using the value of the D1 _(W) and thevalue of the relative distance D1 _(M) between the first mask-pattern 4a and the second mask-pattern 4 b on the mask 1, a relative positiondeviation amount (D1 _(W)−D1 _(M)) of the first resist-pattern 14 a andsecond resist-pattern 14 b is determined. This position deviation amount(D1 _(W)−D1 _(M)) is compared with the characteristic graphs shown inFIG. 9, depending on the exposure conditions of the exposure apparatus 5such as the off-axis amount of the illuminating light source 6. As aresult, the defocus amount d from the focal point (f=0) of theprojecting optical system 9 of the semiconductor substrate 13 can bedetermined by suppressing in a range capable of substantially ignoringthe measuring error. When measuring the relative distance D1 _(W)between the first resist-pattern 14 a and the second resist-pattern 14b, a general inspection apparatus such as overlay inspection system usedin general inspection of exposure apparatus can be used.

As explained herein, according to the method for inspecting an exposureapparatus of the present embodiment, it is not necessary to use anyspecial mask or execute complicated exposure operation such as doubleexposure. Moreover, positioning error of the mask 1 and semiconductorsubstrate 13 can be eliminated, and the state of the optical system ofthe exposure apparatus 5 can be investigated by measuring the relativedistance D1 _(W) between the first mask-pattern 4 a and the secondmask-pattern 4 b by using a general inspection apparatus such asso-called overlay inspection system. Hence, the state of the opticalsystem of the exposure apparatus 5 can be measured easily and promptlyat low cost and high precision. In particular, in the method forinspecting an exposure apparatus of the first embodiment, the focalpoint (f=0) of the exposure apparatus 5 (projecting optical system 9)can be measured easily and promptly at low cost and high precision.

An exposure method for correcting a focal point in the presentembodiment is described.

On the basis of the defocus amount d from the focal point (f=0) of theprojecting optical system 9 of the semiconductor substrate 13 determinedby the method for inspecting an exposure apparatus of the presentembodiment mentioned above, the semiconductor substrate 13 is movedalong the direction of the optical axis 16, and is disposed so that thesurface of the photo resist 17 may coincide with the best focal pointF_(b) of the projecting optical system 9. That is, by disposing thesemiconductor substrate 13 at an appropriate focal point (f=0), thefocal point (f=0) of the projecting optical system 9 is substantiallycorrected. As a result, in a proper focused state, the image 14 of themask-pattern 4 can be exposed, projected and transferred on the photoresist 17. Therefore, a favorable pattern transfer is realized.

As explained herein, according to the exposure method for correcting afocal point in the present embodiment, it is not necessary to use anyspecial mask or execute complicated exposure operation such as doubleexposures. Moreover, positioning error of the mask 1 and semiconductorsubstrate 13 can be eliminated, and the focal point can be corrected andexposure by using a general inspection apparatus such as so-calledoverlay inspection system. Hence, the image 14 of the mask-pattern 4 ofproper shape can be transferred easily and promptly at low cost and highprecision. The mask-pattern for transferring the image by the exposuremethod for correcting a focal point of the present embodiment is notlimited to the mask-pattern 4 for inspection, but may include anymask-pattern to be transferred when manufacturing semiconductor deviceas an actual product.

A method for manufacturing a semiconductor device of the presentembodiment is described below.

The method for manufacturing a semiconductor device basically comprisesa step in which the state of the optical system of the exposureapparatus 5 is inspected by the method for inspecting an exposureapparatus of the present embodiment, the optical system of the exposureapparatus 5 is set in a proper state on the basis of the result, thesemiconductor substrate 13 having a photosensitive material (photoresist) 17 provided on the principal plane 13 a is disposed at a properfocal point (f=0) of the projecting optical system 9 of the exposureapparatus 5, and the image of a mask-pattern for manufacturing asemiconductor device (not shown) is transferred on the photo resist 17,and a resist-pattern is formed.

In particular, the method for manufacturing a semiconductor device ofthe present embodiment is characterized by comprising a step in whichthe focal point of the projecting optical system 9 is corrected to aproper state by the exposure method for correcting a focal point of thepresent embodiment, the semiconductor substrate 13 having the photoresist 17 provided on the principal plane 13 a is disposed at a properfocal point (f=0) of the projecting optical system 9, and the image of amask-pattern for manufacturing a semiconductor device (not shown) istransferred on the photo resist 17, and a resist-pattern is formed.

According to the exposure method for correcting a focal point of thepresent embodiment mentioned above, the image of the mask-pattern 4 of aproper shape can be transferred on the photo resist 17 easily andpromptly at low cost and high precision. Therefore, the method formanufacturing a semiconductor device of the present embodiment iscapable of forming the resist-pattern for manufacturing semiconductor ofproper shape and a proper exposure state, easily and promptly at lowcost and high precision. As a result, conforming semiconductor devicescan be manufactured easily and efficiently at low cost.

The mask which is used in the present embodiment is not limited to themask 1 in which a set of mask-patterns 4 consisting of the firstmask-pattern 4 a and second mask-pattern 4 b as mentioned above isformed. For example, as shown in FIG. 10, it is also possible to use amask 21 in which a mask-pattern 24 is formed, the mask-pattern 24 beingcomposed by including at least one pair of mask-patterns, disposing thefirst mask-pattern 4 a and second mask-pattern 4 b on a mask substrate22 in a mirror symmetrical configuration in their width direction.

In this mask-pattern 24, for example, a central position of a firstmask-patterns 23 a composed of a pair of isolated fine lines is supposedto be T_(M), and a central position of a second mask-patterns 23 bcomposed of a pair of isolated thick lines is supposed to be F_(M). Asshown in FIG. 10, on the mask substrate 22, the mask-pattern 24 isformed so that T_(M) and F_(M) may coincide with each other. In the samemanner as in the method for inspecting an exposure apparatus mentionedabove, the image of the mask-pattern 24 is transferred on the photoresist 17, and a resist-pattern 25 is formed as shown in FIG. 11.Herein, a central position of a first resist-patterns 25 a correspondingto the pair of first mask-patterns 23 a is supposed to be T_(W), and acentral position of a second resist-patterns 25 b corresponding to thepair of second mask-patterns 23 b is supposed to be F_(W).

According to the principle mentioned above, the pair of firstresist-patterns 25 a are hardly deviated in their positions, but thepair of second resist-patterns 25 b are deviated in their positions. Asa result, the central position F_(W) of the pair of secondresist-patterns 25 b is also deviated. The central positions T_(W) andF_(W) of the pair of first resist-patterns 25 a not deviated inposition, and the pair of second resist-patterns 25 b deviated inposition are measured, and on the basis of the result of measurement,the magnitude of relative interval (relative distance) ΔX1 between theboth central positions T_(W) and F_(W) is determined. This relativedistance ΔX1 between the both central positions T_(W) and F_(W)corresponds to the relative position deviation amount of the bothresist-patterns 25 a, 25 b. That is, the relative distance ΔX1corresponds to the relative position deviation amount (D1 _(W)−D1 _(M))of the first resist-pattern 14 a and second resist-pattern 14 bmentioned above.

Therefore, by determining this position deviation amount ΔX1, in thesame manner as in the method for inspecting an exposure apparatusmentioned above, the defocus amount d of the semiconductor substrate 13from the focal point (f=0) of the projecting optical system 9 can bedetermined at high precision. Moreover, by using the mask 21 having themirror symmetrical mask-patterns 24 formed therein, the measuringprecision of the defocus amount d can be further enhanced. Still more,the quality of semiconductor device manufactured by the method formanufacturing a semiconductor device of the present embodiment can befurther enhanced.

The pair of first mask-patterns 23 a and the pair of secondmask-patterns 23 b for composing the mask-pattern 24 may be alsodisposed by exchanging the inside and outside along their widthdirection. More specifically, as shown in FIG. 12, in order that a pairof first mask-patterns 33 a and a pair of second mask-patterns 33 b maybe mutually mirror symmetrical, the pair of second mask-patterns 33 bare disposed at the inside in the width direction of the pair of firstmask-patterns 33 a, thereby forming a mask-pattern 34 on a masksubstrate 32. By using a mask 31 having such mask-pattern 34, the sameeffects as in the case of using the mask 21 are obtained by similarlyexecuting the method for inspecting an exposure apparatus, exposuremethod for correcting a focal point, and method for manufacturing asemiconductor device according to the present embodiment.

The mask-pattern is not limited to the mirror symmetrical configurationonly in one direction along the width direction as in the case of themask-patterns 24, 34 mentioned above. For example, as shown in FIG. 13,a pair of first mask-patterns 43 a and a pair of second mask-patterns 43b are disposed in a mirror symmetrical configuration in their widthdirection. At the same time, another pair of first mask-patterns 43 aand pair of second mask-patterns 43 b are disposed mirror symmetricallyin their width direction, and orthogonally to the width direction of thefirst two pairs of mask-patterns 43 a, 43 b. Thus, a mask-pattern 44composed of at least two pairs of mirror symmetrical mask-patterns maybe formed on a mask substrate 42. That is, the mask-pattern 44 may beformed as a so-called bar-in-bar-pattern.

When using such mask 41 having the mask-pattern of so-calledbar-in-bar-pattern such as the mask-pattern 44 formed therein, asindicated by blank arrow in FIG. 13, it may be set to illuminate theprincipal ray 15 of the exposure light 7 from an oblique direction tothe mask-patterns 43 a, 43 b forming the bar-in-bar-pattern 44. At thetime of defocusing, accordingly, the position deviation amount inmutually straight two directions of the images by two pairs of mirrorsymmetrical mask-patterns can be measured, and the measuring precisionof the defocus amount d may be further enhanced. Therefore, from thefocal point (f=0) of the projecting optical system 9, the defocus amountd of the semiconductor substrate 13 can be determined at higherprecision. As a result, the quality of the semiconductor devicemanufactured by the method for manufacturing a semiconductor device ofthe present embodiment may be further enhanced.

Second Embodiment

A method for inspecting an exposure apparatus, an exposure method forcorrecting a focal point, and a method for manufacturing a semiconductordevice according to a second embodiment of the invention will bedescribed while referring to FIG. 14 to FIG. 29.

The method for inspecting an exposure apparatus, exposure method forcorrecting a focal point, and method for manufacturing a semiconductordevice of the second embodiment are same as those of the firstembodiment in the configuration and process except that the mask-patternformed on the mask used at the time of execution is different from thatin the first embodiment. Therefore, only different points are explained,and same parts as in the first embodiment are identified with samereference numerals, and their description is omitted.

In third and fourth embodiments described below, same as in the secondembodiment, only the points different from the first embodiment areexplained.

In the method for inspecting an exposure apparatus, exposure method forcorrecting a focal point, and method for manufacturing a semiconductordevice of the second embodiment, a mask 51 having a mask-pattern 55 asshown in FIG. 14 formed on a mask substrate 52 is used. The mask-pattern55 is composed of a set of first mask-pattern 53 and second mask-pattern54 mutually different in shape. The set of first mask-pattern 53 andsecond mask-pattern 54 are disposed parallel to each other.

Specifically, the first mask-pattern 53 is composed of a set of aplurality of parallel lines 53 a by disposing, as shown in FIG. 14,relatively thin lines (bands) 53 a having a specified width W_(L)relatively at a narrow interval W_(L), mutually spaced at an equalinterval, and parallel to each other. In the following explanation,parallel lines 53 a composed of a plurality of relatively thin lines arecollectively called line portions 53 a, and a mutual interval betweenline portions 53 a is called a space portion 53 b. The firstmask-pattern 53 composed of the line portions 53 a and space portions 53b is called a line-and-space-pattern (L/S-pattern) 53. A so-called pitch(pattern pitch) P of the L/S-pattern 53 can be expressed as W_(L)+W_(S),where W_(L) is the width of line portions 53 a and W_(S) is the intervalbetween space portions 53 b.

On the contrary, the second mask-pattern 54 b is formed as relativelythick isolated lines (bands) having a length equal to the line portions53 a of the first mask-pattern (L/S-pattern) 53, and also having apredetermined width W_(F) wider than the width W_(L) of the lineportions 53 a of the first mask-pattern 53. In the followingexplanation, the second mask-pattern 54 is called theisolated-line-pattern (IL-pattern) 54.

The first mask-pattern 53 and second mask-pattern 54 are disposedparallel to each other, in a state spaced by a specified length ofrelative distance D2 _(M) on the mask substrate 52. The length of therelative distance D2 _(M) is preset so as to have enough size at leastnot to allow overlapping of the images 56, 57 of the first mask-pattern53 and second mask-pattern 54 to be exposed and projected on the photoresist 17.

FIG. 15 shows a resist-pattern 58 formed on the photo resist 17 whenilluminating the mask-pattern 55 in an off-axis state setting theoff-axis amount Dc from the optical axis 16 of the illuminating lightsource 6, for example, at 0.3 σ. That is, as projected images of thefirst mask-pattern 53 and second mask-pattern 54, a first resist-pattern56 and a second resist-pattern 57 are shown. The first maskresist-pattern (L/S-resist-pattern) 56 is formed as a line portion 56 aand a space portion 56 b in the same manner as the first mask-pattern(L/S-pattern) 53. The relative distance between the first resist-pattern56 and the second resist-pattern 57 on the surface 13 a of thesemiconductor substrate 13 is supposed to be D2 _(W).

Dimensions of the L/S-pattern 53 are specifically described. To executethe present embodiment, the pitch P (W_(L)+W_(S)) of the L/S-pattern 53must satisfy the following condition.

In order to form the first resist-pattern 56 and second resist-pattern57 of proper shape suited to measurement of the defocus amount d, adiffraction light of order of 0 and a diffraction light of order of 1generated when the exposure light 7 (illuminating light 7 a) passesthrough the L/S-pattern 53 must both enter the pupil of the projectionlens 11. The state of these diffraction lights is explained below whilereferring to FIG. 16. The illuminating light 7 a reaching the mask 1 atincident angle α is diffracted by the L/S-pattern 4 of the pitch P, andejected toward the projection lens 11 as a diffraction light(transmission light) 7 b of diffraction angle α+β. At this time, whensin β becomes larger than the numerical aperture NA_(p) of theprojection lens 11, the diffraction light 7 b cannot enter theprojection lens 11. Therefore, the diffraction angle is maximum when sinα is equal to the numerical aperture NA_(i) of the illuminating lens 10and sin β becomes equal to the numerical aperture NA_(p) of theprojection lens 11. Accordingly, in terms of the numerical apertureNA_(p) of the projection lens 11 and wavelength λ of the exposure light7 (illuminating light 7 a), the pitch P of the L/S-pattern 53 mustsatisfy the relation shown in the following formula (3).P<λ/(NA _(p) +NA _(i))  (3)

Herein, the angles of α and β must be considered by selecting the anglecloser to the optical axis 16 if the illuminating light source 6 spreadswidely. In FIG. 16, the spreading case of the illuminating light source6 is not shown.

In the present embodiment, the L/S-pattern 53 composed of parallel wiresof equal interval is preferred to be formed in the condition that theposition of the image 56 does not deviate (does not change) from thedesired position even if the semiconductor substrate 13 is at defocuspoint F_(d) (if out of focus). Accordingly, in FIG. 16, the angle α andangle 13 must be set nearly equal to each other. That is, the pitch P isdesired to satisfy the relation of the following formula (4).P=λ/2 sin α  (4)

When the relation in formula (4) is satisfied, a diffraction light oforder of 0 and a diffraction light of order of 1 are in a symmetricalrelation with respect to the optical axis 16, and therefore if theimaging position is deviated from the focal point (f=0) of theprojecting optical system 9, the position of the image 56 is alwaysconstant. In this case, if the illuminating light source 6 spreads, ashould be considered in the position of the center of the light source6.

FIG. 17 and FIG. 18 are graphs expressed by each shape of amask-pattern, showing the correlative relation of the focus amount dfrom the focal point (f=0) of the projecting optical system 9 of thesemiconductor substrate 13, and the position deviation amount of thedesired projecting position of a general mask-pattern image projected onthe surface of the photo resist 17, at the off-axis amount Dc of 0.5 σof the illuminating light source 6. FIG. 17 refers to theisolated-line-pattern 54, and FIG. 18 shows the L/S-pattern 53.

As shown in FIG. 17, as the defocus amount d increases, the positiondeviation amount of the exposed and projected image (secondresist-pattern) 57 of the isolated-line-pattern 54 is increased. Whenthe line width W_(F) of the isolated-line-pattern 54 is 0.4 μm or more,the position deviation amount of the image 57 is known to be almostconstant regardless of the pattern size of the isolated-line-pattern 54.When the line width W_(F) of the isolated-line-pattern 54 is 0.2 μm orless, the position deviation amount of the image 57 is known to berelatively small as compared with the pattern of larger size. Bycontrast, when the line width W_(F) of the isolated-line-pattern 54 is0.25 μm or more, as compared with the case of the line width W_(F) ofthe isolated-line-pattern 54 of 0.2 μm, the position deviation amount ofthe image (pattern) 57 at the time of defocusing is 2 times or more.Therefore, in the second embodiment intended to set so that the exposedand projected image of the second pattern may be deviated in position atthe time of defocusing, it is desired that the line width W_(F) of theisolated-line-pattern 54 may set larger than 0.25 μm.

Accordingly, using the standardization amount K defined in the formula(2) in the first embodiment, the line width W_(F) of theisolated-line-pattern 54 is expressed in a standardized dimension. Inthe second embodiment, the wavelength λ of the exposure light 7 is 0.248μm, and the numerical aperture NA_(p) of the projection lens 11(projecting optical system 9) is 0.68. Therefore, the standardizationamount K is about 0.365, and the line having a width of 0.25 μm or morecorresponds to the standardized dimension of 0.69 or more.

Referring next to FIG. 18, the mask-pattern of the L/S-pattern 53 isdiscussed. According to FIG. 18, it is known that the correlativerelation of the defocus amount d from the focal point (f=0) of theprojecting optical system 9 of the semiconductor substrate 13 and theposition deviation amount of the exposed and projected image (firstresist-pattern) 56 of the L/S-pattern 53 is different significantlydepending on the size of the pitch P of the L/S-pattern 53. Inparticular, when the size of the pitch P is 0.36 μm, as compared withthe pitch P of other sizes, it is known that the position deviationamount of the image 56 at the time of defocusing is significantlysmaller. This is because the diffraction light of the exposure light 7(transmission light 7 b) passing through the L/S-pattern 53 satisfiesthe condition of the formula (4).

As mentioned above, the numerical aperture NA_(p) of the projection lens11 is 0.68 in this case, and the illumination coherency σ in off-axisstate of the illuminating light source 6 is 0.5. Hence, sin α=0.34.Putting wavelength λ=248 nm in the formula (4), then P=364.7 nm, and itis known to be equal to the pitch P of the L/S-pattern 53. That is, whenthe size of the pitch P of the L/S-pattern 53 is set to satisfy therelation of formula (4) approximately, if the semiconductor substrate 13is defocused, the position of the image 56 of the L/S-pattern 53 ishardly moved (shifted). Therefore, in the second embodiment intended toset so as not to cause position deviation of the exposed and projectedimage of the first mask-pattern at the time of defocusing, it ispreferred that the size of the pitch P of the L/S-pattern 53 may beformed at about 0.36 μm.

Dimensions of the L/S-pattern 53 as the first mask-pattern and theisolated-line-pattern 54 as the second mask-pattern are set in specificsize. For the isolated-line-pattern 54, as a pattern size in a region ofinducing a position deviation having a substantially constantcorrelative relation between the position deviation amount at the timeof defocusing of the image 57 and the defocus amount d of thesemiconductor substrate 13, a mask-pattern having a line width W_(F) of1 μm is selected. For the L/S-pattern 53, as the pitch P in a size notto induce position deviation (not to shift the position of image 56) atthe time of defocusing of the image 56, the pitch P having a size of0.36 μm is selected. That is, the with W_(L) of the line portion 53 ofthe L/S-pattern 53 and width W_(S) of the space portion 53 b are set at0.18 μm each. The L/S-pattern 53 and isolated-line-pattern 54 of thespecified dimensions are disposed (formed) on a mask substrate 52parallel to each other across a relative distance D2 _(M) as shown inFIG. 14.

Using the mask 51, the image of the mask-pattern 55 composed of theL/S-pattern 53 and isolated-line-pattern 54 is exposed, projected andtransferred on the photo resist 17 provided on the surface 13 a of thesemiconductor substrate 13 as shown in FIG. 15, and a resist-pattern 58is formed.

FIG. 19 shows the difference, in this case, between the relativedistance D2 _(W) between the L/S-pattern 53 and theisolated-line-pattern 54, and the relative distance D2 _(W) between theindividual images of the first resist-pattern 56 and secondresist-pattern 57, that is, a position deviation amount (D2 _(W)−D2_(M)). In FIG. 19, the relative position deviation amount (D2 _(W)−D2_(M)) of the first resist-pattern 56 and second resist-pattern 57 isexpressed in a graph on the basis of the relative distance D2 _(W)between the both resist-patterns 56, 57 when the semiconductor substrate13 is at the focal point (f=0) of the projecting optical system 9. Thatis, FIG. 19 is a graphical expression of change of relative distance D2_(W) between both patterns 56, 57, on the basis of the case free fromposition deviation in both first resist-pattern 56 and secondresist-pattern 57 (D2 _(W)−D2 _(M)=0).

As clear from FIG. 19, it is known that a certain constant correlativerelation is established between the defocus amount d of thesemiconductor substrate 13 and the relative position deviation amount(D2 _(W)−D2 _(M)) of the first resist-pattern 56 and secondresist-pattern 57. Therefore, by comparing the relative positiondeviation amount (D2 _(W)−D2 _(M)) of the first resist-pattern 56 andsecond resist-pattern 57 with the characteristic graph shown in FIG. 19,the defocus amount d of the semiconductor substrate 13 can be determinedat high precision.

In the second embodiment, as the first mask-pattern 53, a mask-patternin a condition that the position of the exposed and projected image(pattern) 56 does not shift (does not deviate) at the time of defocusingof the semiconductor substrate 13 is selected. As the case may be,however, such mask-pattern may not be selected. For example, it may beforced to select a mask-pattern deviated in both image 56 of theL/S-pattern 53 and image 57 of the isolated-line-pattern 54. In such acase, however, the dimensions (pitch and shape) of the L/S-pattern 53and isolated-line-pattern 54 may be formed so that the deviation amountsof the images 56, 57 may be different from each other. As a result, bymeasuring the relative distance D2 _(W) between the image 57 of theisolated-line-pattern 54 and the image 56 of the L/S-pattern 53 at aperiodic specific pitch P, the defocus amount d of the semiconductorsubstrate 13 can be determined.

When using a pattern (L/S-pattern) having a predetermined periodic pitchP as the first mask-pattern 53 or second mask-pattern 54, since thepatterns at both outsides in the width direction of each mask-patterngroup are not periodic, the position deviation amount of each image isdifferent. Accordingly, if a more accurate measurement is desired, it isdesired to remove the image of the mask-patterns at both outsides in thewidth direction of the periodic-pattern (L/S-pattern) from theposition-measuring region.

As one means, as shown in FIG. 20 and FIG. 21, for example, a mask 51having a periodic-pattern 53, which includes 53 a and 53 b, as amask-pattern A formed therein and a mask 61 having openings 60 a, 60 bas a mask-pattern B formed therein for emitting light to line portions59 a, 59 b in the both outside portions in the width direction of theperiodic-pattern 53 are prepared on the mask substrate 62 formed of alight shielding material. After exposing the periodic-pattern 53 on thesemiconductor substrate 13, the openings 60 a, 60 b are exposed byoverlapping with the periodic-pattern 53 by using the mask 61 beforedevelopment. Then images of both mask-patterns A, B are developed. As aresult, on the surface 13 a of the semiconductor substrate 13, aresist-pattern C as an image 64 as shown in FIG. 22 is obtained. Asindicated by broken line in FIG. 22, resist-patterns 63 a, 63 bcorresponding to the line portions 59 a, 59 b in the both outsideportions in the width direction of the periodic-pattern 53 are dissolvedand eliminated at the time of development by exposing the openings 60 a,60 b. Consequently, only the resist-pattern 56, which includes 56 a and56 b, corresponding to the periodic middle portion of theperiodic-pattern 53 is left over.

By such method, for example, when overlapped exposure is required, evenif there is a slight error in the precision of stage position, the errorhardly has any effect on the position of the image (pattern) to beexposed itself. Therefore, it achieves the object of forming aresist-pattern for measuring defocus point capable of practicallyignoring the stage positioning error likely to occur at the time ofdouble exposure.

The mask which is used in the second embodiment is not limited to themask 51 having the mask-pattern 55 composed of a set of L/S-pattern 53and isolated-line-pattern 54 of FIG. 14 mentioned above formed therein,but may include, for example, a mask having a mask-pattern composed ofperiodic-pattern (L/S-pattern) formed at a specific pitch in both firstmask-pattern and second mask-pattern.

For example, as shown in FIG. 23, a first mask-pattern 73 is anL/S-pattern 73 having a line width W_(L1) of a line portion 73 a and aninterval W_(S1) of a space portion 73 b of 0.18 μm both, and the pitchP1 (W_(L1)+W_(S1)) of 0.36 μm. A second mask-pattern 74 is anL/S-pattern 74 having a line width W_(L2) of a line portion 74 a and aninterval W_(S2) of a space portion 74 b of 0.21 μm both, and the pitchP2 (W_(L2)+W_(S2)) of 0.42 μm. These two L/S-pattern 73 and L/S-pattern74 are disposed on a mask substrate 72 parallel to each other, beingspaced from each other at a relative distance of D3 _(M).

Using a mask 71 in which a mask-pattern 75 composed of two L/S-patterns73, 74 thus different in pitch from each other is formed, as shown inFIG. 24, a resist-pattern 78 for measurement is formed. In the samemanner as in the case of using the mask 51, a first resist-pattern(first L/S-resist-pattern) 76 as the image of the first L/S-pattern 73is formed as a line portion 76 a and a space portion 76 b. Similarly, asecond resist-pattern (second L/S-resist-pattern) 77 as the image of thesecond L/S-pattern 74 is formed as a line portion 77 a and a spaceportion 77 b. The relative distance between the first L/S-pattern 76 andthe second L/S-pattern 77 on the surface 13 a of the semiconductorsubstrate 13 is D3 _(W).

In the case of using the mask 71, the defocus amount d of thesemiconductor substrate 13 and a relative position deviation amount (D3_(W)−D3 _(M)) of the first resist-pattern 76 and second resist-pattern77 are known to have a substantially constant correlative relation asshown in FIG. 25. Therefore, by comparing the relative positiondeviation amount (D3 _(W)−D3 _(M)) of the first resist-pattern 76 andsecond resist-pattern 77 with the characteristic graph shown in FIG. 25,the defocus amount d of the semiconductor substrate 13 can be determinedat high precision.

Alternatively, a mask 81 having a mask-pattern 85 as shown in FIG. 26formed therein may be used. The mask-pattern 85 formed on the mask 81 iscomposed of a set of mask-patterns 83 and 84 formed on the mask 81 bydisposing on a mask substrate 82 mirror symmetrically to a widthdirection thereof.

In this mask-pattern 85, for example, a central position of twoL/S-patterns 83 is C_(M), and a central position of two patterns 84composed of thick isolated lines is S_(M). As shown in FIG. 26, themask-pattern 85 is formed so that C_(M) and S_(M) may coincide with eachother on the mask substrate 82. As in the exposure method for exposureapparatus mentioned above, the image of the mask-pattern 85 istransferred on the photo resist 17 provided on the surface 13 a of thesemiconductor substrate 13, and a resist-pattern 88 is formed as shownin FIG. 27. Herein, a central position of two resist-patterns 86 by thepair of L/S-patterns 83 is C_(W), and a central distance between tworesist-patterns 87 by the pair of patterns 84 of thick isolated lines isS_(W).

According to the principle mentioned above, the pair of resist-patterns86 are hardly deviated in their positions, but the pair ofresist-patterns 87 are deviated in their positions. As a result, thecentral position S_(W) of the pair of resist-patterns 87 is alsodeviated. The central positions C_(W) and S_(W) of the pair ofresist-patterns 86 not deviated in position, and the pair ofresist-patterns 87 deviated in position are measured. On the basis ofthe result of measurement, the magnitude of relative interval (relativedistance) ΔX2 between the both central positions C_(W) and S_(W) isdetermined. This relative distance ΔX2 between the both centralpositions C_(W) and S_(W) corresponds to the relative position deviationamount of the both resist-patterns 86, 87. That is, the relativedistance ΔX2 corresponds to the relative position deviation amount (D2_(W)−D2 _(M)) of the first resist-pattern 56 and second resist-pattern57 mentioned above.

Therefore, by determining this position deviation amount ΔX2, in thesame manner as in the case of the method for inspecting an exposureapparatus mentioned above, the defocus amount d of the semiconductorsubstrate 13 from the focal point (f=0) of the projecting optical system9 can be determined at high precision. Moreover, the quality ofsemiconductor device manufactured by the method for manufacturing asemiconductor device of the present embodiment can be further enhanced.

The pair of L/S-patterns 83 and the pair of patterns 84 of thickisolated lines for composing the mask-pattern 85 may be also disposed byexchanging the inside and outside along their width direction. Morespecifically, as shown in FIG. 28, in order that a pair of L/S-patterns93 and a pair of patterns 94 of thick isolated lines may be mutuallymirror symmetrical, the pair of L/S-patterns 93 are disposed at theinside in the width direction of the pair of patterns 94 of thickisolated lines, thereby forming a mask-pattern 95 on a mask substrate92. By using a mask 91 having such mask-pattern 95, the same effects asin the case of using the mask 81 are obtained by similarly executing themethod for inspecting an exposure apparatus, exposure method forcorrecting a focal point, and method for manufacturing a semiconductordevice according to the present embodiment.

The mask-pattern is not limited to the mirror symmetrical configurationonly in one direction along the width direction as in the case of themask-patterns 85, 95 mentioned above. For example, as shown in FIG. 29,a pair of L/S-patterns 103 and a pair of patterns 104 of thick isolatedlines are disposed in a mirror symmetrical configuration in their widthdirection. At the same time, another pair of L/S-patterns 103 and a pairof patterns 104 of thick isolated lines are disposed mirrorsymmetrically in their width direction, and orthogonally to the widthdirection of the both pairs of patterns 103, 104. Thus, a mask-pattern105 composed of at least two pairs of mirror symmetrical mask-patternsmay be formed on a mask substrate 102. That is, the mask-pattern 105 maybe formed as a so-called bar-in-bar-pattern.

When using such mask 101 having the mask-pattern of so-calledbar-in-bar-pattern such as this mask-pattern 105 formed therein, asindicated by blank arrow in FIG. 29, it may be set to illuminate theprincipal ray 15 of the exposure light 7 from an oblique direction tothe patterns 103, 104 forming the bar-in-bar-pattern 105. At the time ofdefocusing, accordingly, the position deviation amount in mutuallystraight two directions of the images by two pairs of mirror symmetricalmask-patterns can be measured, and the measuring precision of thedefocus amount d may be further enhanced. Therefore, the defocus amountd of the semiconductor substrate 13 from the focal point (f=0) of theprojecting optical system 9 can be determined at higher precision. As aresult, the quality of the semiconductor device manufactured by themethod for manufacturing a semiconductor device of the presentembodiment may be further enhanced.

As mentioned above, there is no problem even if the thick patterns 84,87, 94, and 104 shown in FIG. 26 to FIG. 29 are L/S-patterns asexplained in FIG. 23 and the like.

The method for inspecting an exposure apparatus, exposure method forcorrecting a focal point, and method for manufacturing a semiconductordevice of the second embodiment are same as the method for inspecting anexposure apparatus, exposure method for correcting a focal point, andmethod for manufacturing a semiconductor device of the first embodiment,except for the points explained above, and the same problems to besolved by the invention can be similarly solved.

Third Embodiment

A method for inspecting an exposure apparatus, an exposure method forcorrecting a focal point, and a method for manufacturing a semiconductordevice according to a third embodiment of the invention will bedescribed while referring to FIG. 30.

The third embodiment is intended to illuminate the mask by setting theilluminating light source in an off-axis state substantially offset fromthe optical axis, without using illuminating aperture, when executingthe method for inspecting an exposure apparatus, exposure method forcorrecting a focal point, and method for manufacturing a semiconductordevice of the first and second embodiments.

As shown in FIG. 30, a shield band 201 is disposed as a light shieldingmember at the plane position or in its vicinity at the back side (backside of pattern side, illuminating light source side principal plane) ofthe mask substrate 2 corresponding to the mask-pattern 4. By this shieldband 201, of the exposure light 7 (illuminating light 7 a) emitted fromthe illuminating light source 6, the exposure light 7 (illuminatinglight 7 a) for illuminating the mask-pattern 4 along the optical axis isshielded. The shield band 201 is disposed oppositely to a region wherethe mask-pattern (measuring-pattern) 4 is formed, that is, to concealthe mask-pattern 4 substantially from its back side. By thus disposingthe shield band 201, the illuminating light 7 a entering from straightlyabove along the optical axis direction toward the mask-pattern 4 can beshielded. At the same time, the illuminating light 7 a entering towardthe mask-pattern 4 from its oblique direction can be also set in a stateso that only the portion in one direction can reach the mask-pattern 4.Therefore, without using the illuminating aperture 12, the illuminatinglight 7 a is set substantially in a state located off the center of theoptical axis, so that the mask-pattern 4 can be illuminated in anoff-axis state.

Fourth Embodiment

A method for inspecting an exposure apparatus, an exposure method forcorrecting a focal point, and a method for manufacturing a semiconductordevice according to a fourth embodiment of the invention will bedescribed while referring to FIG. 31.

The fourth embodiment is, in the same manner as in the third embodiment,intended to illuminate the mask by setting the illuminating light sourcein an off-axis state substantially offset from the optical axis, withoutusing illuminating aperture.

As shown in FIG. 31, a shield band 302 is disposed as a light shieldingmember on a blind surface 301 nearly conjugate optically with the backside (back side of pattern side, illuminating light source sideprincipal plane) of the mask substrate 2, or in the vicinity thereof. Byilluminating the mask-pattern 4 for measurement in this state, the sameeffect as in the third embodiment is obtained. That is, the illuminatinglight 7 a entering from straightly above along the optical axisdirection toward the mask-pattern 4 can be shielded. At the same time,the illuminating light 7 a entering toward the mask-pattern 4 from itsoblique direction can be also set in a state so that only the portion inone direction can reach the mask-pattern 4. Therefore, without using theilluminating aperture 12, the illuminating light 7 a is setsubstantially in a state located off the center of the optical axis, sothat the mask-pattern 4 can be illuminated in an off-axis state.

In the third and fourth embodiments, the shield band is disposed at theillumination side from the pattern side, but the shield band may be alsodisposed at the projecting optical system side from the pattern side. Insuch configuration, by shielding part of the diffraction light passingthrough the pattern, an off-axis illuminating state is presentedsubstantially.

The method for inspecting an exposure apparatus, exposure method forcorrecting a focal point, and method for manufacturing a semiconductordevice of the invention are not limited to the first to fourthembodiments. So far as not departing from the true spirit and scope ofthe invention, the configuration or part of process may be changed andmodified, or various settings may be combined.

The exposure apparatus to which the invention is applicable is notlimited to the exposure apparatus of a telecentric optical system.

When measuring the relative position of a mask-pattern image formeasuring position deviation, an electron microscope may be used asmeasuring means, or an optical measuring apparatus may be used. Inparticular, by using the so-called overlay inspection system mentionedabove, measurement is easy and prompt.

The image-receiving element on which the mask-pattern is projected isnot limited to the semiconductor substrate having the photo resistformed thereon as mentioned above. For example, by using alight-receiving element such as CCD, it is possible to measure by thesame principle. In this case, if a filter or the like is disposed beforethe light-receiving element, basically, it can be handled same asexposure and projection on the semiconductor substrate.

The present invention is mainly explained about detection of the focalpoint of the exposure apparatus (projecting optical system), butposition deviation of thick lines and thin lines is known to be causedby coma aberration of the optical system. For example, the inventorsreported in Jpn. J. Appl. Phys., Vol. 37 (1998), page 3553. Further,about the relation of position deviation of the periodic-pattern andaberration, the inventors reported in Applied Optics, Vol. 38, No. 13(1999), page 2800. Therefore, the invention is applied not only inmeasurement of the focal point of the exposure apparatus (projectingoptical system), but also in measurement of aberration of the opticalsystem.

In this case, the method for inspecting an exposure apparatus of theinvention may be expressed as a method for inspecting an exposureapparatus characterized by illuminating a mask, in which a mask-patternincluding a set of first mask-pattern and second mask-pattern mutuallydifferent in shape is formed, from a direction in which a point locatedoff an optical axis of an exposure apparatus is a center ofillumination, exposing and projecting an image of the mask-patterntoward an image-receiving element, and measuring a relative distancebetween images of the first and second mask-patterns exposed andprojected on the image-receiving element, thereby inspecting theaberration of the optical system of the exposure apparatus.

Further, the mask-pattern for measurement (inspection) of positiondeviation composed of the first mask-pattern and second mask-pattern maybe formed integrally with the mask having the actual mask-patterns formanufacturing a semiconductor device formed therein. In this case, toavoid mutual interference of the images by the mask-patterns, themask-pattern for measurement of position deviation and the mask-patternfor manufacturing a semiconductor device may be spaced from each otherat a specified interval.

In such configuration of the mask, inspection of the optical system ofthe exposure apparatus, exposure method for correcting a focal point,and an actual exposure operation (photolithographic process) can be doneby using one mask. Specifically, prior to the actual exposure operation,it is inspected whether or not the optical system of the exposureapparatus satisfies the predetermined conditions by using the mask, inany method for the first to fourth embodiments. When the predeterminedconditions are satisfied, the actual exposure operation is started. Ifthe conditions are not satisfied, the optical system of the exposureapparatus is adjusted so as to satisfy the conditions, and the actualexposure operation is started. In such manner, prior to the actualexposure operation, the optical system of the exposure apparatus isalways set in an appropriate state, and a circuit-pattern of highprecision can be easily transferred on a wafer. As a result,semiconductor devices of high performance can be manufactured promptlyand easily.

Additional advantages and modifications will readily occur to thoseskilled in the art. Therefore, the invention in its broader embodimentsis not limited to the specific details and representative embodimentsshown and described herein. Accordingly, various modifications may bemade without departing from the spirit or scope of the general inventiveconcept as defined by the appended claims and their equivalents.

1. An exposure method for correcting a focal point, comprising:illuminating a mask a single time, said mask being a mask in which amask-pattern including at least a set of a first mask-pattern and asecond mask-pattern mutually different in shape is formed, from adirection in which a point located off an optical axis of an exposureapparatus is a center of illumination, using an asymmetric illuminationlight to the optical axis, and exposing and projecting an image of saidmask-pattern toward an image-receiving element, said asymmetricillumination light having a single chief ray incidence direction;measuring a mutual relative distance between images of said first andsecond mask-patterns exposed and projected on said image-receivingelement, thereby measuring a focal point of a projecting optical systemof said exposure apparatus; and moving said image-receiving elementalong a direction of said optical axis of said exposure apparatus on abasis of a result of said measurement, and disposing saidimage-receiving element at an appropriate focal point of said projectingoptical system.
 2. The method according to claim 1, wherein said firstand second mask-patterns are respectively formed in one linear shapemutually different in width, and disposed parallel to each other.
 3. Themethod according to claim 2, wherein said first and second mask-patternsare formed so that a value of dividing a width of lines composing saidfirst and second mask-patterns, by using a value obtained by dividing awavelength of an exposure light emitted by a light source of saidexposure apparatus by a numerical aperture of a projecting opticalsystem of said exposure apparatus is 0.69 or more in said line composingone mask-pattern, and 0.55 or less in said line composing the othermask-pattern.
 4. The method according to claim 3, wherein a locationamount off said optical axis of said exposure apparatus whenilluminating said mask is larger than a value obtained by dividing anumerical aperture of an illuminating optical system of said exposureapparatus by said numerical aperture of said projecting optical systemof said exposure apparatus.
 5. The method according to claim 1, whereinone of said first and second mask-patterns is formed in a shape havingat least one line, and the other is formed in a shape having a pluralityof lines mutually spaced from each other, and said at least one line ofsaid first mask-patterns is formed with a different width from, andparallel to, said lines of said second mask-pattern.
 6. The methodaccording to claim 1, wherein said first and second mask-patterns arerespectively formed in a shape having a plurality of lines spaced fromeach other, and widths of said lines of said first and secondmask-patterns and intervals of said lines are set different from eachother, and disposed parallel to each other.
 7. The method according toclaim 1, wherein said mask-pattern includes at least one pair ofmask-patterns composed of said set of first and second mask-patterns andanother set of first and second mask-patterns formed so as to be mirrorsymmetrical on a width direction of said set of first and secondmask-patterns.
 8. The method according to claim 7, further comprising:with respective to said pairs of mask-patterns, determining centralpositions of images of said first mask-pattern and central positions ofimages of said second mask-pattern, and measuring a relative distancebetween said central positions, thereby measuring a relative distancebetween said images of said first and second mask-patterns.
 9. Themethod according to claim 7, wherein said mask-pattern includes at leasttwo pair of mask-patterns composed of said pair of mask-patterns andanother pair of mask-patterns formed so as to be orthogonal to a widthdirection of said at least one pair of mask-patterns.
 10. The methodaccording to claim 9, further comprising: with respect to said at leasttwo pairs of mask-patterns, determining a central position of saidmutual images of said first mask-pattern and a central position of saidmutual images of said second mask-pattern, and measuring a relativedistance between said mutual central positions, thereby measuring arelative distance between said mutual images of said first and secondmask-patterns in two mutually orthogonal directions.
 11. The methodaccording to claim 1, wherein said image-receiving element is asemiconductor substrate having a photosensitive material disposed at aprincipal plane side on which said image of said mask-pattern is exposedand projected, and as a relative distance between said mutual images ofsaid first and second mask-patterns, a relative distance between mutualresist-patterns with respect to said first and second mask-patternsformed on said photosensitive material is measured on a basis of saidimage of said exposed and projected mask-pattern.
 12. The methodaccording to claim 1, further comprising: providing a light shieldingmember disposed at a position confronting said mask-pattern, on asurface opposite to or adjacent to said side having said mask-pattern ofsaid mask provided thereon.
 13. The method according to claim 1, furthercomprising: providing a light shielding member disposed at a position ofshielding an exposure light incident to said mask-pattern from adirection along said optical axis of said exposure apparatus so thatsaid exposure light illuminating said mask enters toward saidmask-pattern only from one direction located off said direction alongsaid optical axis of said exposure apparatus, wherein said lightshielding member is disposed any one of at a substantially conjugateposition optically to a side opposite said side having said mask-patternof said mask provided thereon, and adjacent to said substantiallyconjugate position.
 14. A method for manufacturing a semiconductordevice, comprising: illuminating a mask a single time, said mask being amask in which a mask-pattern including at least a set of a firstmask-pattern and a second mask-pattern mutually different in shape isformed, said mask being illuminated from a direction in which a pointlocated off an optical axis of an exposure apparatus is a center ofillumination, using an asymmetric illumination light to the oDticalaxis, and exposing and projecting an image of said mask-pattern towardan image-receiving element, said asymmetric illumination light having asingle chief ray incidence direction; measuring a mutual relativedistance between images of said first and second mask-patterns exposedand projected on said image-receiving element, thereby inspecting astate of an optical system of said exposure apparatus; setting saidoptical system of said exposure apparatus in an appropriate state on abasis of a result of said measurement; disposing a semiconductorsubstrate having a photosensitive material provided thereon on aprincipal plane at an appropriate focal point of a projecting opticalsystem of said exposure apparatus; and forming a resist-pattern bytransferring an image of a mask-pattern for manufacturing asemiconductor on said photosensitive material.
 15. A method formanufacturing a semiconductor device, comprising: illuminating a mask asingle time, said mask being a mask in which a mask-pattern including atleast a set of a first mask-pattern and a second mask-pattern mutuallydifferent in shape is formed, said mask being illuminated from adirection in which a point located off an optical axis of an exposureapparatus is a center of illumination, using an asymmetric illuminationlight to the optical axis, and exposing and projecting an image of saidmask-pattern toward an image-receiving element, said asymmetricillumination light having a single chief ray incidence direction;measuring a mutual relative distance between images of said first andsecond mask-patterns exposed and projected on said image-receivingelement, thereby measuring a focal point of a projecting optical systemof said exposure apparatus; setting said focal point of said projectingoptical system in an appropriate state on a basis of a result of saidmeasurement, and disposing a semiconductor substrate having aphotosensitive material provided thereon on a principal plane at anappropriate focal point of said projecting optical system; and forming aresist-pattern by transferring an image of a mask-pattern formanufacturing a semiconductor on said photosensitive material.